
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
PIN A1
REFERENCE
2X 0.10 C
2X 0.10 C
E
TOP VIEW
A B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
5X
0.10 C
0.05 C
NOTE 3
A
A1
A2
C
SEATING
PLANE
DIM
A
A1
A2
b
D
E
e
e1
MIN MAX
0.29 0.39
0.10 0.14
0.23 REF
0.14 0.18
0.86 BSC
0.84 BSC
0.30 BSC
0.52 BSC
SIDE VIEW
A1 PACKAGE
NOTE 4
0.10
M
5X b
C A B
C
B
e
e1
RECOMMENDED
SOLDERING FOOTPRINT*
OUTLINE
A
PIN A1
REFERENCE
1 2 3
BOTTOM VIEW
0.52
PITCH
5X
0.30
PITCH
0.16
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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